imaginary_num6er@alien.topB to HardwareEnglish · 10 months agoSK Hynix and Nvidia reportedly working on a radical GPU redesign that 3D-stacks HBM memory directly on top of the processing coreswww.tomshardware.comexternal-linkmessage-square18fedilinkarrow-up13arrow-down10
arrow-up13arrow-down1external-linkSK Hynix and Nvidia reportedly working on a radical GPU redesign that 3D-stacks HBM memory directly on top of the processing coreswww.tomshardware.comimaginary_num6er@alien.topB to HardwareEnglish · 10 months agomessage-square18fedilink
minus-squaremonocasa@alien.topBlinkfedilinkEnglisharrow-up1·10 months agoHeat. The processor generates most of the heat, so you want the back side of the die somewhere a heat spreader can more or less directly connect to.
Heat. The processor generates most of the heat, so you want the back side of the die somewhere a heat spreader can more or less directly connect to.