AMD Corporate VP David McAfee recently addressed the matter in an interview with Quasar Zone. When asked about AMD’s power consumption versus operating temperature compared to the competition and if temperature issues are something that could be resolved in the future, McAfee said they’re working closely with TSMC to put a lot of effort into process technology.

However, they believe that the current situation involving high heat density will persist or perhaps be further intensified as more advanced processes are utilized in the future. As such, it’ll be important for AMD to find a way to effectively eliminate the high amount of heat generated by high-density chiplets, McAfee added.