imaginary_num6er@alien.topB to HardwareEnglish · 2 years agoSK Hynix and Nvidia reportedly working on a radical GPU redesign that 3D-stacks HBM memory directly on top of the processing coreswww.tomshardware.comexternal-linkmessage-square18linkfedilinkarrow-up13arrow-down10
arrow-up13arrow-down1external-linkSK Hynix and Nvidia reportedly working on a radical GPU redesign that 3D-stacks HBM memory directly on top of the processing coreswww.tomshardware.comimaginary_num6er@alien.topB to HardwareEnglish · 2 years agomessage-square18linkfedilink
minus-squareExist50@alien.topBlinkfedilinkEnglisharrow-up1·2 years agoThese are all in flip-chip packages. So no, power would come up through the bottom, and the transistors would be closest to the top.
These are all in flip-chip packages. So no, power would come up through the bottom, and the transistors would be closest to the top.