minus-squareFloppie7th@alien.topBtoHardware•VideoCardz: "AMD to consider chiplet design for mainstream mobile APUs once it's more cost-effective and power-efficient"linkfedilinkEnglisharrow-up1·1 year ago7000 series uses a new I/O die on TSMC 6nm instead of GloFo 14nm, that’s probably making a big difference linkfedilink
7000 series uses a new I/O die on TSMC 6nm instead of GloFo 14nm, that’s probably making a big difference