• ThreeLeggedChimp@alien.topB
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    1 year ago

    Thats because AMD just glued together dies on their desktop CPUs to make MCM CPUs, and called them chiplets.

    Eg. The thing that Intel and IBM had already done years before.

    Apple’s MCM CPUs are power efficient because the dies are right next to each other, but those CPUs cost many times more than either Intel’s or AMDs CPUs.

    Intel is trying to leapfrog Apple and AMD by making tiled CPUs, but the packaging method is way more complex and expensive than either of its competitors.